Capabilities

Our services feed into a number of diverse products from R&D support through to volume production.

  • Surface Mount Assembly
    • Multiple automated pick and place machines
    • Rigid and flexible PCBs, including FR-4, PTFE (Teflon), ceramic and aluminium substrates
    • PCBs for high frequency applications. e.g. RF and microwave circuits
    • Leadless packages including BGA, uBGA (0.4mm pitch), LCC, QFN
    • Packages with fine-pitch leads. e.g. QFP and TSOP (0.3mm)
    • Rectangular chip packages down to 0402 (1.0mm wide).
  • Through Hole Assembly
  • Mixed technology assemblies with combinations of both surface mount and through hole components on either side of the PCB
  • Multiple vapour phase (condensation) reflow machines
  • Two Automated Optical Inspection (AOI) machines, including one 3D profiling system
  • Three surface mount production lines consisting of a combination of pick and place and stencil printing machines
  • X-ray inspection machine
  • Centrifugal PCB washing / cleaning machine
  • Cleanliness testing for ionic contamination
  • Advanced rework capabilities
  • Mechanical assembly of PCAs into next highest and final assemblies
  • Prototype assembly
  • Volume production

Contact us for a quotation.

Contact Us »