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  • Surface Mount Assembly
    • Multiple automated pick and place machines
    • Rigid and flexible PCBs, including FR-4, PTFE (Teflon), ceramic and aluminium substrates
    • PCBs for high frequency applications. e.g. RF and microwave circuits
    • Leadless packages including BGA, µBGA (0.4mm pitch), LCC, QFN
    • Packages with fine-pitch leads. e.g. QFP and TSOP (0.3mm)
    • Rectangular chip packages down to imperial 0201 (0.5mm x 0.25mm)
  • Through Hole Assembly
  • Mixed technology assemblies with combinations of both surface mount and through hole components on either side of the PCB
  • Multiple vapour phase (condensation) reflow machines
  • Two Automated Optical Inspection (AOI) machines, including one 3D profiling system
  • Three surface mount production lines consisting of a combination of pick and place and stencil printing machines
  • Two X-ray inspection machines
  • Two centrifugal PCB washing / cleaning machines
  • Cleanliness testing for ionic contamination
  • Advanced rework capabilities
  • Mechanical assembly of PCAs into next highest and final assemblies
  • Prototype assembly
  • Volume production

Defence Customers

Please contact us directly for our quad chart.

Research Organisations

Please contact us directly for our research and development flyer.

Pick and place machine close up
Contact Us

Telephone: (02) 4335 1410


ISO 9001 mark
IPC Member mark
Certified IPC Trainer mark
ABN 84 166 982 912