We are highly experienced with BGA assembly, with the capability to fit µBGAs down to 0.4mm pitch, to large heavy BGAs with over 1500 balls.
Our surface mount processes can assemble PCBs with fine pitch devices, and rectangular chips down to 0402 (imperial) sizes.
We can accommodate a range of PCBs, from FR-4, PTFE, ceramic and aluminium substrates. We have numerous happy customers with RF and microwave circuit assemblies.
Puzzle Precision is at the forefront of electronic assembly with a strong focus on the critical reliability and defence markets. With our extensive production equipment and capabilities, we can assemble surface mount and through hole components, BGAs, rigid and flexible PCBs and much more.
We operate in compliance with our AS/NZS ISO 9001:2015 certified QMS and are commited to the continual improvement of our processes and systems.