Capabilities

• Surface Mount Assembly
  • Multiple automated pick and place machines
  • Rigid and flexible PCBs, including FR-4, PTFE (Teflon), ceramic and aluminium substrates
  • PCBs for high frequency applications. e.g. RF and microwave circuits
  • Leadless packages including BGA, µBGA (0.4mm pitch), LCC, QFN
  • Packages with fine-pitch leads. e.g. QFP and TSOP (0.3mm)
  • Rectangular chip packages down to imperial 0201 (0.5mm x 0.25mm)
• Through Hole Assembly
• Mixed technology assemblies with combinations of both surface mount and through hole components on either side of the PCB
• Multiple vapour phase (condensation) reflow machines
• Two Automated Optical Inspection (AOI) machines, including one 3D profiling system
• Three surface mount production lines consisting of a combination of pick and place and stencil printing machines
• Two X-ray inspection machines
• Two centrifugal PCB washing / cleaning machines
• Cleanliness testing for ionic contamination
• Advanced rework capabilities
• Mechanical assembly of PCAs into next highest and final assemblies
• Prototype assembly
• Volume production