Our services feed into a number of diverse products from R&D support through to volume production.
Puzzle Precision assembles a wide range of products including:
Our vapour phase (condensation) reflow processes have been proven to still be the superior reflow method for BGAs & LCCs, multi-layered and composite boards. It allows lower maximum reflow temperatures, has minimal temperature differentials across a board and does not suffer from shadowing and other detrimental effects often associated with other reflow techniques.
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In addition to the complete assembly service, we also offer the following as stand-alone services to assist customers: